Vacuum Hybrid Hexapods

As part of Allient, ALIO’s Vacuum Hybrid Hexapod is engineered specifically for ultra-high vacuum (UHV) environments where traditional stacked motion systems fall short. Instead of layering multiple stages, increasing height, footprint, outgassing surface area, and cable complexity, this monolithic design delivers true 6-DOF motion in a compact, vacuum-optimized architecture.

By decoupling planar motion from angular adjustments, the Hybrid Hexapod eliminates parasitic errors and travel limitations common to conventional hexapods. The result is a significantly stiffer, thermally stable system capable of nanometer-level precision, even in the most demanding semiconductor and photonics applications.

Benefits & Advantages:

• Monolithic, non-stacked architecture optimized for vacuum environments
• Reduced outgassing surface area and cable volume
• Decoupled planar and angular motion for higher stiffness
• Continuous 360° yaw capability
• Large XY travel with micron level accuracy and sub-micron bi-directional repeatability
• Exceptional thermal stability in UHV conditions

Market Segments & Applications
Semiconductor: EUV Lithography, Wafer Inspection, Photomask Alignment, Advanced Metrology
Photonics: Silicon Photonics (SiP) Wafer Probing, Fiber-to-Wafer Alignment, Vacuum Fiber Packaging
Advanced Manufacturing: High-speed Metrology, Precision Optical Steering, Nano-positioning in Vacuum Environments